cystech electronics corp. spec. no. : c326s2-c issued date : 2009.02.16 revised date :2013.09.27 page no. : 1/7 zd5221bs2 series cystek product specification 200mw sod-323 zener voltage regulators zd5221bs2 thru zd5259bs2 description the zd5221bs2 series zener diodes are packaged in a sod-323 surface mount p ackage that has a power dissipation of 200mw. they are designed to provide voltage regulati on protection and are especially attractive in situations where space is at a premium. they are well suited for a pplications such as cellular phon es, hand held portables, and high density pc boards. features ? standard zener breakdown voltage range : 2.4v to 39v ? steady state power rating of 200mw.. ? small body outline dimensions ? low body height : 0.035 inches (0.9mm) max. mechanical data ? case : sod-323 , molded plastic ? terminals : solderable per mil-std-750 method 2026 ? polarity : cathode indicated by polarity band. ? flammability rating : ul94 v-0 ? package weight : approx. 4.507 mg/unit ? mounting position : any ordering information device package shipping zd52xxbs2-0-t1-g sod-323 (pb-free lead plating and halogen-free package) 3000 pcs / tape & reel environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t1 : 3000 pc s / tape & reel, 7? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c326s2-c issued date : 2009.02.16 revised date :2013.09.27 page no. : 2/7 zd5221bs2 series cystek product specification symbol outline sod-323 - + absolute maximum ratings (ta=25 , unless otherwise specified) ? maximum temperatures storage temperature tstg................................................................................................... . -65~+150 c junction temperature tj?????????????????????????.. -65~ +150 c ? maximum power dissipation total power dissipation ptot (note 1) ........................................................................................ 200 mw ? thermal resistance, junction to ambient air r ja ???????????????.??.625 /w ? thermal resistance, junction tocase r jc ???????????????.?????..400 /w note 1: parts mounted on ceramic board with area of 25mm2. electrical characteristics (t a =25 unless otherwise noted, v f =0.9v max @i f =10ma for all types.) symbol parameter v z reverse zener voltage @ i zt i zt reverse current z zt maximum zener impedance @ i zt i zk reverse current z zk maximum zener impedance @ i zk i r reverse leakage current @ v r v r reverse voltage
cystech electronics corp. spec. no. : c326s2-c issued date : 2009.02.16 revised date :2013.09.27 page no. : 3/7 zd5221bs2 series cystek product specification zener voltage( note 2 ) maximum zener impedance maximum reverse leakage current v z (volts) @i zt z zt @ i zt z zk @i zk i r @v r device marking code min nom max ma ? ? ma a v zd5221b c1 2.28 2.4 2.52 20 30 1200 0.25 100 1.0 zd5223b c3 2.57 2.7 2.84 20 30 1300 0.25 75 1.0 zd5225b c5 2.85 3.0 3.15 20 30 1600 0.25 50 1.0 ZD5226B g1 3.14 3.3 3.47 20 28 1600 0.25 25 1.0 zd5227b g2 3.42 3.6 3.78 20 24 1700 0.25 15 1.0 zd5228b g3 3.71 3.9 4.10 20 23 1900 0.25 10 1.0 zd5229b g4 4.09 4.3 4.52 20 22 2000 0.25 5 1.0 zd5230b g5 4.47 4.7 4.94 20 19 1900 0.25 5 2.0 zd5231b e1 4.85 5.1 5.36 20 17 1600 0.25 5 2.0 zd5232b e2 5.32 5.6 5.88 20 11 1600 0.25 5 3.0 zd5233b e3 5.70 6.0 6.30 20 7 1600 0.25 5 3.5 zd5234b e4 5.89 6.2 6.51 20 7 1000 0.25 5 4.0 zd5235b e5 6.46 6.8 7.14 20 5 750 0.25 3 5.0 zd5236b f1 7.13 7.5 7.88 20 6 500 0.25 3 6.0 zd5237b f2 7.79 8.2 8.61 20 8 500 0.25 3 6.5 zd5238b f3 8.27 8.7 9.14 20 8 600 0.25 3 6.5 zd5239b f4 8.65 9.1 9.56 20 10 600 0.25 3 7.0 zd5240b f5 9.50 10 10.50 20 17 600 0.25 3 8.0 zd5241b h1 10.45 11 11.55 20 22 600 0.25 2 8.4 zd5242b h2 11.40 12 12.60 20 30 600 0.25 1 9.1 zd5243b h3 12.35 13 13.65 9.5 13 600 0.25 0.5 9.9 zd5245b h5 14.25 15 15.75 8.5 16 600 0.25 0.1 11 zd5246b j1 15.20 16 16.80 7.8 17 600 0.25 0.1 12 zd5248b j3 17.10 18 18.90 7.0 21 600 0.25 0.1 14 zd5250b j5 19.00 20 21.00 6.2 25 600 0.25 0.1 15 zd5251b k1 20.90 22 23.10 5.6 29 600 0.25 0.1 17 zd5252b k2 22.80 24 25.20 5.2 33 600 0.25 0.1 18 zd5254b k4 25.65 27 28.35 5.0 41 600 0.25 0.1 21 zd5255b k5 26.60 28 29.40 4.5 44 600 0.25 0.1 21 zd5256b m1 28.50 30 31.50 4.2 49 600 0.25 0.1 23 zd5257b m2 31.35 33 34.65 3.8 58 700 0.25 0.1 25 zd5258b m3 34.20 36 37.80 3.4 70 700 0.25 0.1 27 zd5259b m4 37.05 39 40.95 3.2 80 800 0.25 0.1 30 note 2: zener voltage is measured with a pulse test current i z at an ambient temperature of 25 .
cystech electronics corp. spec. no. : c326s2-c issued date : 2009.02.16 revised date :2013.09.27 page no. : 4/7 zd5221bs2 series cystek product specification recommended footprint mm inch
cystech electronics corp. spec. no. : c326s2-c issued date : 2009.02.16 revised date :2013.09.27 page no. : 5/7 zd5221bs2 series cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c326s2-c issued date : 2009.02.16 revised date :2013.09.27 page no. : 6/7 zd5221bs2 series cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c326s2-c issued date : 2009.02.16 revised date :2013.09.27 page no. : 7/7 zd5221bs2 series cystek product specification sod-323 dimension *: typical inches d a h j k c e b 1 2 style: pin 1.cathode 2.anode 2-lead sod-323 plastic surface mounted package cystek package code: s2 marking: 5 h xx millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.0630 0.0709 1.60 1.80 e 0.0060 - 0.15 - b 0.0453 0.0531 1.15 1.35 h 0.0000 0.0040 0.00 0.10 c 0.0315 0.0394 0.80 1.00 j 0. 0035 0.0070 0.089 0.177 d 0.0098 0.0157 0.25 0.40 k 0.0906 0.1063 2.30 2.70 notes: 1.controlling dimension : millimeters. 2.lead thickness specified per l/f drawing with solder plating. 3.if there is any question with pa cking specification or packing me thod, please contact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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